Electronic circuit device including heat-generating element mounted on circuit board
AssigneeDenso Corporation
InventorAtsushi Yamaguchi
Life of this patent
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Abstract
An electronic circuit device including a heat-generating element is mounted on a circuit board composed of three laminated layers: a heat-receiving layer on which the heat-generating element is mounted, an insulating layer, and a heat-dissipating layer. The heat-receiving layer is connected to the heat-dissipating layer through heat-conductive passages formed in the insulating layer. The heat generated in the heat-generating element is transferred to the heat-dissipating layer through the heat-conductive passages, and the heat is efficiently dissipated on both the heat-receiving layer and the heat-dissipating layer.
Claims7
An electronic circuit device comprising:
- a circuit board including a heat-receiving layer, an insulating layer and a heat-dissipating layer, all the layers being laminated in this order;
- heat-conductive passages formed through the insulating layer for connecting the heat-receiving layer and the heat-dissipating layer;
- and
- a heat generating element mounted on the heat-receiving layer, wherein:
- a pattern for suppressing heat dispersion from a mounting region in which the heat-generating element is mounted is formed on the heat-receiving layer.
A circuit board for mounting thereon an electronic circuit device including a heat-generating element, the circuit board comprising:
- a heat-receiving layer for mounting the heat-generating element thereon;
- a heat-dissipating layer;
- an insulating layer laminated between the heat-receiving layer and the heat-dissipating layer;
- and
- heat-conductive passages, formed through the insulating layer, connecting the heat-receiving layer and the heat-dissipating layer, wherein
- the heat-receiving layer includes a pattern formed thereon for suppressing heat dispersion from a mounting region in which the heat-generating element is mounted.
Dependencies are inferred from the claim text.