Inspection for alignment between IC die and package substrate
AssigneeAdvanced Micro Devices, Inc.
InventorsSwee Peng Lee, Ajit Dubey, Leang Hua Kam, Loo Kean Teoh
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Abstract
In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.
Claims32
A method for inspecting alignment between an IC (integrated circuit) die and a package substrate, comprising:
- locating a plurality of fiducials on the package substrate for determining a plurality of references;
- determining a center point of the package substrate from the plurality of references;
- determining whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range;
- and
- generating an alarm for preventing reflow of solder bumps of the IC die onto pads of the package substrate when the center point of the IC die is not aligned to the center point of the package substrate within the acceptable range.
A method for inspecting alignment between an IC (integrated circuit) die and a package substrate comprising:
- locating a plurality of fiducials on the package substrate for determining a plurality of references;
- determining a center point of the package substrate from the plurality of references;
- and
- determining whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range;
- wherein each of the fiducials is comprised of a plurality of markings with each marking having a same size and shape as each pad on the package substrate.
A system for inspecting alignment between an IC (integrated circuit) die and a package substrate, comprising:
- a plurality of fiducials located on the package substrate for determining a plurality of references;
- means for determining a center point of the package substrate from the plurality of references;
- means for determining whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range;
- and
- means for generating an alarm when the center point of the IC die is not aligned to the center point of the package substrate within the acceptable range.
Dependencies are inferred from the claim text.