Method and device with variable resilience springs for testing integrated circuit packages

An IC package testing device comprising:

• an IC package receiver including a recess sized and shaped to receive an IC package;
• a lid attached to said receiver by a hinge;
• a pressure pad positioned in the lid so as to overlie the recess;
• a closure mechanism positioned opposite the hinge;
• and,
• a leaf spring coupled by a center pivot to said pressure pad, said leaf spring being formed in a roughly bow shape extending symmetrically about said center pivot to two distal fixed points, said two distal fixed points pivotably coupled to said lid, wherein said leaf spring applies a normal force to an IC package located in said receiver through the pressure pad when said closure mechanism closes said lid on said IC package receiver,
• said leaf spring further comprising a center pivot attachment hole, spring material extending symmetrically to distal end portions, both end portions terminating in fixed attachment holes spaced equidistantly from the center pivot attachment hole, and both end portions of the material curving proximally toward the center pivot attachment hole, such that a curvilinear length of the leaf spring is greater than a linear distance between the fixed attachment holes.

A method for testing IC packages comprising:

• placing an IC package in an IC package receiver;
• clamping the IC package into the receiver by closing a pressure pad onto the IC package;
• applying a normal farce with variable resilience to the IC package through the pressure pad by closing a latch;
• and
• applying the variable resilience with a plurality of leaf springs.

An IC package testing device comprising:

• an IC package receiver;
• a pressure pad;
• a lid;
• a latch;
• and,
• at least two compliance leaf springs that apply a normal force to an IC package through the pressure pad when the lid is in a latched position,
• wherein the at least two compliance leaf springs are positioned on opposite sides of the pressure pad.

An IC package testing device comprising:

• an IC package receiver including a recess sized and shaped to receive an IC package;
• a lid attached to said receiver by a hinge;
• a pressure pad positioned in the lid so as to overlie the recess;
• a closure mechanism positioned opposite the hinge;
• a leaf spring coupled by a center pivot to said pressure pad, said leaf spring being formed in a roughly bow shape extending symmetrically about said center pivot to two distal fixed points, said two distal fixed points pivotably coupled to said lid, wherein said leaf spring applies a normal force to an IC package located in said receiver through the pressure pad when said closure mechanism closes said lid on said IC package receiver;
• a first pivot pin received through coaxially aligned holes in the pressure pad and one or more of said leaf springs, said holes in the pressure pad aligned centrally in the pressure pad and said leaf springs positioned on either side of the pressure pad;
• and,
• second and third pivot pins aligned parallel to the first pivot pin, and received through coaxially aligned holes in the leaf springs and the lid.