Bonding configuration structure for facilitating electrical testing in a bonding process and a testing method using the same
AssigneeAu Optronics Corporation
InventorsHui-Chang Chen, Chun-Yu Lee
Life of this patent
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Abstract
A bonding configuration structure for facilitating electrical testing in a bonding process and a testing method are provided. The bonding configuration includes a bonded component, a bonding component, a bond portion and a leading component. The bonding component is disposed on the bonded component. The bonding component has a first end and a second end. The first end is coupled to the bond portion. The second end is disposed on the bonded component to form the first testing portion.
Claims18
A bonding configuration structure for facilitating electrical testing in a bonding process, comprising:
- a bonded component;
- a bonding component, disposed on the bonded component;
- a bond portion, for connecting the bonding component and the bonded component;
- a leading component having a first end and a second end, the first end being coupled to the bond portion, and the second end being disposed on the bonded component to form a first testing portion;
- and
- a flexible printed circuit board bonded on the bonded component, the flexible printed circuit board having a second testing portion coupled to the first testing portion.
A method for testing a bonding configuration, comprising:
- providing a bonded component and a bonding component;
- forming a bond portion on the bonding component, wherein the bond portion has an electrical circuit;
- connecting the bonded component and the bonding component via the bond portion;
- coupling a first end of a leading component to the bond portion;
- disposing a second end of the leading component on the bonded component to form a first testing portion;
- providing a flexible printed circuit board, the flexible printed circuit board having a second testing portion;
- bonding the flexible printed circuit board to the bonded component for coupling the second testing portion and the first testing portion;
- and
- measuring a resistance value of the bond portion indirectly through the first testing portion and the second testing portion.
Dependencies are inferred from the claim text.