Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof

A semiconductor package comprising:

• a semiconductor structure including a plurality of electrodes for external connection which are provided on a semiconductor substrate;
• an insulation layer provided on the semiconductor structure;
• an upper wiring which includes connection pad portions and is provided on the insulation lava such that at least a part of the upper wiring is connected to the electrodes for external connection of the semiconductor structure;
• a micro electric mechanical system electrically connected to at least one of the connection pad portions of the upper wiring;
• a protection cover arranged to cover the micro electric mechanical system;
• pole electrodes electrically connected to others of the connection pad potions of the upper wiring;
• and
• an upper insulation film covering vicinities of the pole electrodes, and at least a vicinity of the micro electric mechanical system:
• wherein the protection cover is cylindrical and capped at one end.

A semiconductor package comprising:

• a semiconductor structure including a plurality of electrodes for external connection which are provided on a semiconductor substrate;
• an insulation layer provided on the semiconductor structure;
• an upper wiring which includes connection pad portions and is provided on the insulation layer such that at least a part of the upper wiring is connected to the electrodes for external connection of the semiconductor structure;
• a micro electric mechanical system electrically connected to at least one of the connection pad portions of the upper wiring;
• pole electrodes electrically connected to others of the connection pad potions of the upper wiring;
• solder balls provided on the pole electrodes;
• and
• an upper insulation film covering vicinities of the pole electrodes, and at least a vicinity of the micro electric mechanical system.

A manufacturing method for a semiconductor package, comprising:

• arranging apart from each other on a base plate a plurality of semiconductor structures each comprising:
• (a) a semiconductor substrate including an integrated circuit provided thereon and a plurality of connection pads that are each electrically connected to the integrated circuit, and (b) a plurality of electrodes for external connection which are provided on a semiconductor substrate;
• forming an insulation layer around the semiconductor structures on the base plate;
• forming a first upper insulation film on the semiconductor structures and the insulation layer;
• forming an upper wiring, which includes connection pad portions, on the first upper insulation film, such that at least parts of the upper wiring are connected to the electrodes for external connection of the semiconductor structures;
• arranging a respective micro electric mechanical system at a plurality of the semiconductor structures, said micro electric mechanical system being electrically connected to at least one of the connection pad portions of the upper wiring;
• providing a protection cover to cover each said micro electric mechanical system;
• forming pole electrodes which are electrically connected to others of the connection pad portions of the upper wiring;
• covering vicinities of the pole electrodes and at least a vicinity of each said micro electric mechanical system with a second upper insulation film;
• and
• obtaining a plurality of semiconductor packages each including at least one said micro electric mechanical system by dividing the first and second upper insulation films, the insulation layer, and the base plate between the semiconductor structures.