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US 7,030,483 B2Granted
Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
AssigneeIntel Corporation
InventorsJames C Matayabas, Ashay A. Dani
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Abstract
One embodiment of the invention includes a thermal interface material. The thermal interface material includes a polymer matrix; a plurality of fusible particles dispersed within the polymer matrix; and a plurality of non-fusible particles dispersed within the polymer matrix. The fusible particles have a mean particle size that is greater than the maximum particle size of the non-fusible particles. The thermal interface material improves performance of an integrated circuit.
Claims20
A thermal interface material, comprising:
- a polymer matrix;
- fusible particles dispersed within the polymer matrix;
- and
- non-fusible particles dispersed within the polymer matrix, wherein the fusible particles have a mean particle size that is greater than the maximum particle size of the non-fusible particles when fusible particles and non-fusible particles are blended together in the polymer matrix.
1 more element
Dependencies are inferred from the claim text.