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US 7,030,480 B2Granted
Multilayer board and a semiconductor device
AssigneeFujitsu Limited
InventorsYoshiyuki Kimura, Atsushi Kikuchi, Yoshihiko Ikemoto
Life of this patent
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Abstract
Preparing a bottom grounding layer eliminates grounding pins, thereby the number of signal pins can be increased in a multilayer board that includes a grounding layer, a signal layer, a power supply layer, a grounding via, a signal via, a power supply via and the like in the insulation material of the multilayer board, the bottom grounding layer being electrically connected to the grounding layer.
Claims8
A multilayer board, comprising:
- an insulation material,
- a grounding layer formed in the insulation material, and inter-layer-connected by a grounding via,
- a power supply layer formed in the insulation material, and interlayer-connected by a power supply via,
- a signal layer formed in the insulation material, and inter-layer-connected by a signal via,
- a power supply land formed at the bottom surface of the insulation material, and connected to the power supply layer and to an external point,
- a signal land formed at the bottom surface of the insulation material, and connected to the signal layer and to an external point,
- a bottom grounding layer having a plurality of clearances which the power supply land and the signal land are individually formed within, and
- wherein the bottom grounding layer is provided with a conductive film connection terminal formed by a conductive film, and
- wherein the power supply land and the signal land are respectively each provided with solder ball connection terminals formed by solder balls.
6 more elements
A multilayer board, comprising:
- an insulation material,
- a grounding layer formed in the insulation material, and inter-layer-connected by a grounding via,
- a power supply layer formed in the insulation material, and inter-layer-connected by a power supply via,
- a signal layer formed in the insulation material, and inter-layer-connected by a signal via,
- a grounding land formed at the bottom surface of the insulation material, and connected to the grounding layer and to an external point,
- a signal land formed at the bottom surface of the insulation material, and connected to the signal layer and to an external point,
- a bottom power supply layer having a plurality of clearances which the grounding land and the signal land are individually formed within, and
- wherein the bottom power supply layer is provided with a conductive film connection terminal formed by a conductive film, and
- wherein the grounding land and the signal land are respectively each provided with solder ball connection terminals formed by solder balls.
6 more elements
Dependencies are inferred from the claim text.