Substrate-based IC package
AssigneeInfineon Technologies AG
InventorsMartin Reiss, Steffen Kroehnert
Life of this patent
Estimating the term…
Abstract
The invention relates to a substrate-based IC package that includes a substrate on which a chip is mounted with a die attach material. The substrate is provided with a solder resist and has, on the side opposite the chip, conductor tracks provided with soldering globules. The conductor tracks are electrically coupled to the chip via wire jumpers, which extend through a bond channel which is filled with a mold compound. The chip and the substrate are encapsulated with a mold cap on the chip side. The substrate is provided with spacers for supporting a printing template for applying the die attach material. A strip of a solder resist that surrounds at least the bond channel gaplessly with essentially the same width is provided as the spacer.
Claims12
A packaged integrated circuit comprising:
- a substrate including a bond channel formed in a center portion thereof;
- a spacer formed at a surface of the substrate and surrounding the bond channel;
- a die attach material disposed at the surface of the substrate;
- and
- a semiconductor chip disposed over the surface of the substrate such that the die attach material is between the semiconductor chip and the substrate.
A substrate-based integrated circuit (IC) package comprising:
- a substrate, the substrate being provided with a solder resist and having conductor tracks that are provided with soldering globules;
- a chip mounted on the substrate with a die attach material, wherein the substrate is provided with spacers for supporting a printing template for applying the die attach material;
- a plurality of wire jumpers which extend through a bond channel in the substrate and electrically couple the chip to the conductor tracks;
- a mold compound filling the bond channel;
- and
- a mold cap encapsulating the chip and the substrate.
Dependencies are inferred from the claim text.