Integrated circuit device having flexible leadframe

#The present invention relates generally to the field of packaged integrated circuits and, more particularly, to an integrated circuit (IC) device which includes a leadframe.

#An integrated circuit is generally fabricated utilizing a chip of silicon or other semiconductor material, also referred to as a die. A die is typically installed in a package, and electrically connected to leads of the package. These leads may then be soldered to traces on a printed wiring board (PWB), or other circuit mounting structure, to provide connections between the die and external circuitry.

#A number of different cavity packages are known in the art, and may be used, by way of example, to package a Radio Frequency Laterally Diffused Metal Oxide Semiconductor (RFLDMOS) device or other integrated circuit device. In one type of cavity package, a die is sealed inside a protective enclosure. Leads penetrate the walls of the protective enclosure so that they may be electrically connected to the die. These packages are known in the electronics industry as “air-cavity packages,” since the die resides in a hollow air-filled cavity inside the enclosure.

#FIG. 1 shows top and side views of a flexible leadframe, according to an embodiment of the present invention;

#FIG. 2a shows a perspective view of the flexible leadframe of FIG. 1;

#FIG. 2b shows an exploded view of multiple layers of the flexible leadframe of FIG. 1;

#As will be described in detail below, the present invention in the illustrative embodiment provides an integrated circuit device having a flexible leadframe, as well as techniques for fabricating the flexible leadframe and incorporating the flexible leadframe into the integrated circuit device.

#Referring initially to FIG. 1, a diagram illustrates top and side views of a flexible leadframe 10, according to an embodiment of the present invention. The views provided in FIG. 1 illustrate the elements and the dimensions of the flexible leadframe in the illustrative embodiment. Two leads 12, 14 extend outward from two opposing sides of flexible leadframe 10. A main body 15 of flexible leadframe 10 has an open interior area 16. Leads 12, 14 have exposed areas 17, 18 accessible from interior area 16.

#Regarding the dimensions of flexible leadframe 10, for example, in the illustrative embodiment of FIG. 1, a length l1 of flexible leadframe 10 may be approximately 0.78 inches (in.), while a length l2 of interior area 16 may be approximately 0.66 in. Leads 12, 14 have a length l3 of approximately 0.60 in., when the curved transitions to main body 15 are included in the measurement. A length l4, which excludes these transitions, may be approximately 0.50 in.