Semiconductor device and method of manufacturing the same
AssigneeNEC Electronics Corporation
InventorsYuri Masuoka, Naohiko Kimizuka
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Abstract
A technology of restraining junction leakage in a semiconductor device is to be provided. There is provided a semiconductor device provided with a semiconductor substrate, a gate electrode 9 formed on the semiconductor substrate, and a source/drain region formed beside the gate electrode, wherein the source/drain region 4 comprises a first impurity diffusion region including a first P-type impurity and located in the proximity of a surface of the semiconductor substrate, and a second P-type impurity diffusion region located below the first impurity diffusion region and including a second P-type impurity having a smaller diffusion coefficient in the semiconductor substrate than the first P-type impurity.
Claims13
A semiconductor device provided with a semiconductor substrate;
- a gate electrode formed on said semiconductor substrate;
- and an impurity diffusion region formed beside said gate electrode with a PN junction with a region in the semiconductor substrate;
- wherein:
- the impurity diffusion region comprises a first impurity diffusion region including a first P-type impurity and located in the proximity of a surface of the semiconductor substrate;
- and
- a second P-type impurity diffusion region located below the first impurity diffusion region and including a second P-type impurity having a smaller diffusion coefficient in the semiconductor substrate than the first P-type impurity, each of said first impurity diffusion region and said second impurity diffusion region forming the PN junction with the region of the semiconductor substrate.
A semiconductor device provided with a semiconductor substrate;
- a pair of LDD regions formed apart from each other to define a channel region;
- a gate electrode formed over the channel region,
- a source region formed in contact with one of the LDD regions on an opposite side of the channel region;
- and
- a drain region formed in contact with another LDD region on an opposite side of the channel region;
- each of said source region and said drain region comprises a first impurity diffusion region including a first P-type impurity and located in the proximity of a surface of the semiconductor substrate;
- a second P-type impurity diffusion region located below the first impurity diffusion region and including a second P-type impurity having a smaller diffusion coefficient in the semiconductor substrate than the first P-type impurity;
- and
- each of the LDD regions including the first P-type impurity and not including the second P-type impurity.
A semiconductor device, comprising:
- a gate electrode formed on a semiconductor substrate;
- a LDD region formed beside said gate electrode, the LDD region including a first P-type impurity;
- a sidewall formed on a lateral face of said gate electrode;
- a first impurity diffusion region formed beside the sidewall and in deeper position than the LDD region, the first impurity diffusion region including the first P-type impurity;
- a second impurity diffusion region that is formed beside the sidewall and in further deeper position than the first impurity diffusion region, said second impurity diffusion region including a second P-type impurity that has a smaller diffusion coefficient than a first P-type impurity, wherein an impurity concentration of the second impurity diffusion region is lower than that of the first impurity diffusion region, and distance between second impurity diffusion regions that are formed on both sides of the gate electrode is larger than that between first impurity diffusion regions that are formed on both sides of the gate electrode.
Dependencies are inferred from the claim text.