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US 7,030,432 B2Granted
Method of fabricating an integrated circuit that seals a MEMS device within a cavity
AssigneeIntel Corporation
InventorQing Ma
Life of this patent
Estimating the term…
Abstract
A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device. The method includes forming a MEMS device on a substrate and forming an integrated circuit. The method further includes coupling the substrate to the integrated circuit to form a sealed cavity that includes the MEMS device. The substrate and the integrated circuit are coupled together in a controlled environment to establish a controlled environment within the cavity where the MEMS device is located.
Claims22
An electronic device comprising:
- an integrated circuit that includes a first substrate, the integrated circuit further including a first ring layer on the upper dielectric layer;
- a MEMS device mounted on the integrated circuit within the first ring layer;
- an electronic assembly bonded to the first ring layer to seal the MEMS device within a cavity that is partially defined by the electronic assembly and the first ring layer;
- and
- a conductor that is electrically coupled to the MEMS device, the conductor extending between the integrated circuit and the electronic assembly within the sealed cavity.
2 more elements
An electronic device comprising:
- an integrated circuit that includes a first substrate having an upper dielectric layer, the integrated circuit further including a first ring layer on the upper dielectric layer;
- an electronic assembly that is bonded to the first ring layer to form a cavity defined by the electronic assembly and the first ring layer
- a MEMS device mounted on the electronic assembly such that the MEMS device is within the cavity that is partially defined by the electronic assembly and the first ring layer
- a conductor that is electrically coupled to the MEMS device, the conductor extending between the integrated circuit and the electronic assembly within the sealed cavity.
1 more element
An electronic device comprising:
- a substrate;
- a MEMS device formed on the substrate;
- a pad formed on the substrate;
- a first ring layer formed on the substrate such that the MEMS device and the pad are within the first ring layer;
- and
- an integrated circuit bonded to first ring layer to form a sealed cavity that includes the MEMS device, the integrated circuit including a solder bump that is bonded the pad on the substrate such that the pad and the solder bump are within the sealed cavity.
3 more elements
An electronic device comprising:
- a substrate;
- a pad formed on the substrate;
- a first ring layer formed on the substrate such that pad is within the first ring layer;
- and
- an integrated circuit bonded to first ring layer to form a sealed cavity, the integrated circuit including a MEMS device that is within the sealed cavity, the integrated circuit further including a solder bump that is bonded the pad on the substrate such that the pad and the solder bump are within the sealed cavity.
2 more elements
Dependencies are inferred from the claim text.