Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver
AssigneeOpnext Japan, Inc.
InventorsNoriko Sasada, Kazuhiko Naoe, Masataka Shirai, Hideo Arimoto, Satoshi Tada
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Abstract
A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
Claims4
A chip carrier including a dielectric or semiconductor substrate, one surface of which includes a metal-coated portion and an opposite surface of which includes a metal-coated portion, a high frequency transmission line is arranged on said one surface of the substrate and a semiconductor device is mounted on said metal-coated portion formed on said one surface of the substrate, wherein
- said metal-coated portion of said one surface is connected with said metal-coated portion of said opposite surface through a metal-coated portion formed on a side surface of said substrate.
Dependencies are inferred from the claim text.