Semiconductor light emitting device and fabrication method thereof
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAkihiko Ishibashi, Toshiya Yokogawa, Kiyoshi Ohnaka, Susumu Koike
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAkihiko Ishibashi, Toshiya Yokogawa, Kiyoshi Ohnaka, Susumu Koike
Estimating the term…
The present invention relates to a semiconductor light emitting device comprising a sapphire substrate 11; a u-GaN layer 12 that is formed on top of the substrate 11 and that comprises a plurality of concave portions 121 formed into band-like shapes with predetermined intervals therebetween; a regrown u-GaN layer 13 formed on the u-Ga layer 12; a layered structure that is formed on the u-GaN layer 13 comprises an n-GaN layer 15, an active layer 16, and a p-GaN layer 19; an n-type electrode 24 formed on the n-GaN layer 15 exposed by removing a potion of the layered structure; and a transparent p-type electrode 20 formed on the p-GaN layer 19, wherein the p-type electrode 20 is an emission detection surface, and an air layer S is formed between the bottom surface of the u-GaN layer 13 and the concave portions 121.
A semiconductor light emitting device comprising:
Dependencies are inferred from the claim text.