US 7,030,007 B2 · Via-filling material and process for fabricating semiconductor integrated circuit using the material

Abstract

A via-filling material includes a polymer containing a repeating unit represented by wherein R1 one of hydrogen, fluorine, chlorine, bromine, and methyl group; R2 is one of hydrogen, a C1-3 alkyl group, and a C1-4 alkyl group in which the hydrogen is replaced by at least one of fluorine, chlorine, and bromine; and X is —C(═O)O— or —S(═O)2O—. This via-filling material does not generate deposits around an opening of a via hole during plasma etching and provides a semiconductor integrated circuit with high reliability, even when a trench wider than the via hole is formed by plasma etching around the via hole filled with the via-filling material.

Claims6

Dependent claims

A via-filling material filling a via hole when a trench, wider than the via hole, is formed by plasma etching an insulating film including the via hole, said via-filling material comprising a polymer containing a repeating unit represented by

wherein
R1 is a member selected from the group consisting of hydrogen, fluorine, chlorine, bromine, and methyl group;
R2 is a member selected from the group consisting of hydrogen, a C1-3 alkyl group, and a C1-4 alkyl group in which the hydrogen is replaced by at least one of fluorine, chlorine and bromine;
and
X is —S(═O)2O—.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/623,772Filed 22 Jul 2003

Priority

JP 2002-27430020 Sep 2002

Published

US 2005/0101123 A112 May 2005

Granted

18 Apr 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10W 20/085
For dual-damascene structures: involving intermediate temporary filling with material
H10P 14/6342
Deposition processes: liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
H10P 14/683
Organic materials, e.g. photoresists: carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
H10P 14/687
Carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC: the materials being fluorocarbon compounds, e.g. n or…

Via-filling material and process for fabricating semiconductor integrated circuit using the material

Life of this patent

Via-filling material and process for fabricating semiconductor integrated circuit using the material

Life of this patent

Abstract

Claims6