Device manufacturing method

A manufacturing method for a device in which some or all of plural elements formed on an original substrate are transferred to a final substrate, and some or all of the transferred elements are used to manufacture the device, comprising:

• a first process for providing the plural elements on said original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer;
• a second process for adhering the surface where the terminal sections of said elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of said elements are provided;
• a third process for producing exfoliation in said separation layer between said original substrate and said final substrate;
• and
• a fourth process for separating said original substrate from which the transfer of elements has been completed, from said final substrate.