Cooling system for a semiconductor device and method of fabricating same
AssigneeInternational Business Machines Corporation
InventorsHoward Hao Chen, Louis L. Hsu, Joseph F. Shepard, Jr.
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AssigneeInternational Business Machines Corporation
InventorsHoward Hao Chen, Louis L. Hsu, Joseph F. Shepard, Jr.
Estimating the term…
A cooling system for a semiconductor substrate incudes a plurality of trenches formed from a backside of the semiconductor substrate, and thermally conductive material deposited in the plurality of trenches. A method of forming cooling elements in a semiconductor substrate, includes coating a backside of the semiconductor substrate with a first mask layer, forming a plurality of trench patterns in the first mask layer, etching the semiconductor substrate to form a plurality of trenches along the plurality of trench patterns, and depositing thermally conductive material in the plurality of trenches. Trenches constructed from the backside of a wafer improve efficiency of heat transfer from a front-side to the backside of an integrated-circuit chip. The fabrication of trenches from the backside of the wafer allows for increases in the depth and number of trenches, and provides a means to attach passive and active cooling devices directly to the backside of a wafer.
A method of forming cooling elements in a semiconductor substrate, comprising:
A method of forming an active cooling apparatus on a semiconductor substrate, comprising:
A method of forming cooling elements in a semiconductor substrate, comprising:
A method of forming an active cooling apparatus on a semiconductor substrate, comprising:
A method of forming an active cooling apparatus on a semiconductor substrate, comprising:
Dependencies are inferred from the claim text.