Method for fabricating encapsulated semiconductor components having conductive vias

A method for fabricating semiconductor components comprising:

• providing a plurality of semiconductor dice on a substrate having a first side, a second side and a thickness, the dice comprising a plurality of die contacts;
• forming a plurality of conductive vias in the dice in electrical communication with the die contacts;
• forming a plurality of polymer filled trenches in the substrate then thinning the substrate from the second side to expose the polymer filled trenches;
• etching the substrate to expose portions of the conductive vias;
• forming a plurality of grooves through the polymer filled trenches to singulate the dice;
• and
• forming a plurality of terminal contacts on the dice in electrical communication with the conductive vias.

A method for fabricating semiconductor components comprising:

• providing a semiconductor substrate comprising a plurality of semiconductor dice having a plurality of die contacts, the substrate having a first side, a second side and a thickness;
• forming a plurality of trenches on the first side along peripheral edges of the dice, each trench having a depth less than the thickness;
• forming a plurality of contact bumps on the die contacts;
• forming a plurality of conductive vias in the substrate in electrical communication with the contact bumps;
• forming a first polymer layer on the contact bumps and in the trenches to form polymer filled trenches;
• thinning the substrate from the second side to expose the polymer filled trenches;
• and
• singulating the dice through the trenches such that each component includes a semiconductor die covered on at least five sides by a portion of the first polymer layer, and portions of the polymer filled trenches.

A method for fabricating semiconductor components comprising:

• providing a plurality of semiconductor dice on a semiconductor substrate having a circuit side and a back side;
• forming a plurality of trenches along peripheral edges of the dice part way through the substrate;
• depositing a polymer material in the trenches;
• forming a plurality of contact bumps on the dice;
• forming a first polymer layer on the circuit side and the contact bumps;
• forming a plurality of conductive vias in the dice in electrical communication with the contact bumps;
• thinning the substrate from the back side to contact the polymer material in the trenches and to thin the back side;
• forming a plurality of terminal contacts on the back side or on the circuit side in electrical communication with the conductive vias;
• and
• singulating the dice by forming grooves through the trenches and the polymer material.