Bonding layer for bonding resin on copper surface
AssigneeMec Company Ltd.
InventorsMutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Toshiko Nakagawa
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Abstract
A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 μm and not more than 1 μm. Thus, adhesion between copper and resin can be enhanced.
Claims7
A bonding structure for bonding resin comprising a bonding layer formed an a copper surface, the bonding layer comprising an alloy of:
- (a) copper;
- (b) tin;
- and
- (c) one metal (third metal) selected from the group consisting of:
- silver, zinc, aluminum, bismuth, cobalt, and nickel,
- wherein the copper is contained in an amount of to 5 to 45 atom %, the tin is contained in an amount of 30 to 90 atom %, and the third metal is contained in an amount of 2 to 45 atom %, and
- the bonding layer has a thickness of not less than 0.001 μm and not more than 0.5 μm, and
- wherein the bonding layer is useful for an adhesive layer to resin.
Dependencies are inferred from the claim text.