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AssigneeMitsubishi Shindoh Co., Ltd.
InventorsAkihito Mori, Takeshi Suzuki, Tadao Sakakibara, Shuzo Umezu, Masahiko Ishida
Estimating the term…
A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer 6 formed on the surface of the substrate 3. A soft region 6A spreading in a network-shape and a hard region 6B surrounded by the network of the soft region 6A coexists in the metal plating layer 6. The soft region 6A has a Vickers hardness of 20 to 250, while the hard region 6B has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region 6A. An average size of the network of the soft region 6A is from 5 to 500 μm.
A plated material comprising a metal substrate, a metal plating layer formed on the surface of the substrate, and a soft region spreading in a network-shape and a hard region surrounded by the network of the soft region coexisting in the metal plating layer, wherein the soft region has a Vickers hardness of 20 to 250, the hard region has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region, and an average size of the network of the soft region is from 5 to 500 μm, and
A plated material comprising a metal substrate, a metal plating layer formed on the surface of the substrate, and the metal plating layer has a soft region spreading in a network-shape and a hard region surrounded by the network of the soft region coexisting in the metal plating layer, wherein the substrate is formed of a copper alloy consisting essentially by mass percent of 0.3 to 2% Mg, 0.001 to 0.02% P, 0.0001 to 0.0013% C, 0.0002 to 0.002% O, and the balance of Cu and inevitable impurities.
A plated material comprising a metal substrate, a metal plating layer formed on the surface of the substrate, and the metal plating layer has a soft region spreading in a network-shape and a hard region surrounded by the network of the soft region coexisting in the metal plating layer, wherein the substrate is formed of a copper alloy consisting essentially by mass percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3% Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, 0.001 to 0.2% Mg, 0.0001 to 0.005% C, and the balance of Cu and inevitable impurities.
A method of manufacturing a plated material, comprising the steps of:
Dependencies are inferred from the claim text.