Processing system and method for treating a substrate

A processing system for treating a substrate comprising:

• a chemical treatment system for chemically altering exposed surface layers on said substrate comprising a temperature controlled chemical treatment chamber, a temperature controlled substrate holder mounted within said chemical treatment chamber and configured to be substantially thermally insulated from said chemical treatment chamber, a vacuum pumping system coupled to said chemical treatment chamber, and a gas distribution system configured to introduce one or more process gases into said chemical treatment chamber and having a temperature controlled portion exposed to said one or more process gases in said chemical treatment chamber;
• a thermal treatment system for thermally treating said chemically altered surface layers on said substrate, said thermal treatment system comprising a temperature controlled thermal treatment chamber, a temperature controlled substrate holder mounted within said thermal treatment chamber and configured to be substantially thermally insulated from said thermal treatment chamber, and a vacuum pumping system coupled to said thermal treatment chamber;
• and
• an isolation assembly disposed between said thermal treatment system and said chemical treatment system.