Method and apparatus for metallization of large area substrates

A system for processing large area substrates, comprising:

• a stamp having a patterned surface adapted for microcontact printing;
• a prep station for applying a precursor to the patterned surface, wherein the prep station comprises a temperature control system adapted to maintain the precursor disposed in the prep station at a predetermined temperature;
• a stamping station comprising a large area substrate support;
• and
• a robot adapted to move the stamp between the stamping station and the prep station.

A system for processing large area substrates, comprising:

• a stamp having a patterned surface adapted for microcontact printing;
• a prep station for applying precursor to the patterned surface;
• a stamping station comprising a large area substrate support, wherein the stamping station comprises an electrolyte delivery system adapted to selectively provide an electrolyte to the large area substrate and a source of the electrolyte coupled to the electrolyte delivery system;
• and
• a robot adapted to move the stamp between the stamping station and the prep station.

A system for processing large area substrates, comprising:

• a stamp having a patterned surface adapted for microcontact printing;
• a prep station for applying a precursor to the patterned surface;
• a stamping station comprising a large area substrate support;
• a robot adapted to move the stamp between the stamping station and the prep station;
• and
• a backing coupled to a side of the stamp opposite the patterned surface, the backing having a stiffness greater than that of the stamp, wherein the backing further comprises a plurality of micro-machined barbs extending therefrom and engaging the stamp.

A system for processing large area substrates, comprising:

• a stamp having a patterned surface adapted for microcontact printing;
• a prep station for applying a precursor to the patterned surface;
• a stamping station comprising a large area substrate support;
• a head assembly selectively supported over the prep station and the stamping station and adapted for having the stamp coupled thereto;
• and
• a robot adapted to move the stamp between the stamping station and the prep station.

A system for processing large area substrates, comprising:

• a stamp having a patterned surface adapted for microcontact printing;
• a prep station for applying a precursor to the patterned surface;
• a staging station disposed proximate the prep station and adapted to hold at least one replacement stamp;
• a stamping station comprising a large area substrate support;
• and
• a robot adapted to move the stamp between the stamping station and the prep station.

A system for processing large area substrates, comprising:

• a stamp having a patterned surface adapted for microcontact printing;
• a prep station for applying a precursor to the patterned surface;
• a stamping station comprising a large area substrate support;
• a plating station disposed proximate the stamping station;
• and
• a robot adapted to move the stamp between the stamping station and the prep station.

A system for processing large area substrates, comprising:

• a stamp having a patterned surface adapted for microcontact printing;
• a prep station for applying a precursor to the patterned surface;
• a stamping station comprising a large area substrate support, wherein the stamping station further comprises a plurality of platens adapted to support a respective substrate thereon and a turntable having the platens coupled thereto;
• and
• a robot adapted to move the stamp between the stamping station and the prep station.

A system for processing large area substrates, comprising:

• a stamp having a patterned bottom surface adapted for microcontact printing;
• a prep station, comprising a basin for holding a precursor and adapted to interface with the stamp;
• a stamping station, comprising a first platen adapted to support the large area substrate thereon;
• a vacuum source coupled to the platen and adapted to vacuum chuck the large area substrate to the platen;
• a device adapted to selectively place the stamp in contact with the stamping station and the prep station;
• and
• an electrolyte delivery system adapted to selectively provide an electrolyte to the large area substrate.