Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsNaoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
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Abstract
A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
Claims12
A method for manufacturing a wafer holding plate used in a wafer grinding apparatus, the method comprising the steps of:
- grinding a surface of a substrate to which a semiconductor wafer is adhered by an adhesive;
- masking the ground surface with a predetermined pattern;
- and
- blasting the wafer adhering surface with particles to form a groove pattern.
A method for manufacturing a wafer holding plate used in a wafer grinding apparatus, the method comprising a step of blasting a wafer adhering surface of a substrate with particles to form grooves and to simultaneously round edges of the grooves, wherein a semiconductor wafer is adhered to the completed wafer adhering surface with adhesive.
Dependencies are inferred from the claim text.