Method for cleaning semiconductor wafers
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorGa-Lane Chen
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Abstract
A method for cleaning a surface of semiconductor wafer after chemical mechanical polishing in accordance with the present invention comprises the steps of: (1) providing a semiconductor wafer having a surface to be treated; (2) applying a photocatalyst containing solution to the surface, the solution having a plurality of photocatalyst particles; and (3) applying light to the surface, the light being adapted to activate the photocatalyst particles.
Claims11
A method for cleaning a surface of a semiconductor wafer after chemical mechanical polishing, the method comprising the steps of:
- providing a semiconductor wafer having a surface to be treated;
- applying a photocatalyst containing solution to the surface, the solution having a plurality of photocatalyst particles;
- and
- applying light to the surface, the light being adapted to activate the photocatalyst particles.
A method for cleaning a surface of a semi-finished electronic component after chemical mechanical polishing, the method comprising the steps of;
- providing said semi-finished electronic component having a surface to be treated;
- applying a catalyst containing solution to the surface, the solution having a plurality of catalyst particles;
- and
- applying a non-chemical factor to the surface to activate the catalyst particles.
A method for cleaning a surface of a semi-finished electronic component after chemical mechanical polishing, the method comprising the steps of:
- providing said semi-finished electronic component having a surface to be treated;
- placing the electronic component into a solution containing catalyst particles, the solution being in a sonicator;
- and
- applying a non-chemical factor to the surface to activate the catalyst particles.
Dependencies are inferred from the claim text.