Chemical mechanical polishing compositions for metal and associated materials and method of using same
AssigneeAdvanced Technology Materials, Inc.
InventorsYing Ma, William Wojtczak, Cary Regulski, Thomas H. Baum, David D. Bernhard, Deepak Verma
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Abstract
A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.
Claims40
A chemical mechanical polishing slurry being free of heteropolyacid, said slurry comprising an abrasive and an oxidizing agent selected from the group consisting of hydrogen peroxide, iodic acid, potassium iodate, ferric nitrate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate ammonium persulfate, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, and urea, wherein said abrasive consists essentially of organic polymer.
A chemical mechanical polishing slurry being free of heteropolyacid and consisting essentially of about 5 percent abrasive, about 5 percent hydrogen peroxide, about 0.1 percent citric acid, about 0.2 percent iminodiacetic acid, about 0.013 percent ammonia, and about 90 percent waters, wherein said abrasive consists essentially of poly (methyl methacrylate).
A chemical mechanical polishing slurry composition consisting essentially of from about 0.1 to 50 percent abrasive, from about 0.1 to 25 percent oxidizing agent;
- from about 0 to 5 percent activating agent;
- from about 0 to 3 percent corrosion inhibitor and from about 0 to 3 percent cleaning agent, wherein said abrasive consists essentially of colloidal poly (methyl methacrylate), and wherein said composition is free of heteropolyacid.
Dependencies are inferred from the claim text.