End-point detection apparatus
AssigneeLam Research Corporation
InventorsKatrina A. Mikhaylich, Mike Ravkin, Yehiel Gotkis
Life of this patent
Estimating the term…
Abstract
An apparatus is provided for polishing a substrate. The apparatus includes a polishing pad configured to traverse from at least a first point to a second point. A first sensor is located near the first point and oriented so as to sense an incoming temperature of the polishing pad. A second sensor is located near the second point and oriented so as to sense an outgoing temperature of the polishing pad. A difference between the incoming temperature and the outgoing temperature is then used to determine endpoint of a polishing operation.
Claims16
A chemical mechanical polishing system, comprising:
- a polishing pad configured to move from a first point to a second point;
- a carrier being configured to hold a substrate to be polished over the polishing pad, the carrier being designed to apply the substrate to the polishing pad in a polish location that is between the first point and the second point;
- a first sensor located at the first point and oriented so as to sense an IN temperature of the polishing pad;
- a second sensor located at the second point and oriented so as to sense an OUT temperature of the polishing pad.
An apparatus, comprising:
- a polishing pad configured to move from a first point to a second point;
- a carrier being configured to hold a substrate, the carrier being designed to apply the substrate to the polishing pad in a polish location that is at least partially between the first point and the second point;
- a first sensor located near the first point and oriented so as to sense an incoming temperature of the polishing pad;
- a second sensor located near the second point and oriented so as to sense an outgoing temperature of the polishing pad.
An apparatus, comprising:
- a polishing pad configured to traverse from at least a first point to a second point;
- a first sensor located near the first point and oriented so as to sense an incoming temperature of the polishing pad;
- a second sensor located near the second point and oriented so as to sense an outgoing temperature of the polishing pad, wherein a difference between the incoming temperature and the outgoing temperature is used to determine endpoint of a polishing operation.
Dependencies are inferred from the claim text.