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US 7,029,365 B2Granted
Pad assembly for electrochemical mechanical processing
AssigneeApplied Materials, Inc.
InventorsShou-Sung Chang, Stan D Tsai, Donald J. K. Olgado, Liang-Yuh Chen, Alain Duboust, Ralph M. Wadensweiler
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Abstract
Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
Claims31
A pad assembly for processing a substrate, comprising:
- a processing layer made of a conductive material having a working surface adapted to process the substrate;
- a lower layer coupled to and disposed below the processing layer;
- an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer, wherein the upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface;
- and
- an insulative layer coupled between the electrode and the processing layer.
2 more elements
A pad assembly for processing a substrate, comprising:
- a processing layer having a working surface adapted to process the substrate;
- a lower layer coupled to and disposed below the processing layer;
- an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer, wherein the upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface;
- an insulative layer coupled between the electrode and the processing layer, wherein the processing layer is made of a conductive material;
- wherein the lower layer, electrode, and processing layer are coupled together by an adhesive;
- and
- a release film coupled to a bottom of the lower layer.
4 more elements
A pad assembly for processing a substrate, comprising:
- a processing layer having a working surface adapted to process the substrate;
- a lower layer coupled to and disposed below the processing layer;
- an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer, wherein the upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface;
- an insulative layer coupled between the electrode and the processing layer, wherein the processing layer is made of a conductive material;
- and
- wherein the electrode is made of a laminate of a metal foil on top of a polyimide, polyester, flouroethylene, polypropylene, or polyethylene film.
3 more elements
A pad assembly for processing a substrate, comprising:
- a processing layer having a working surface adapted to process the substrate;
- a lower layer coupled to and disposed below the processing layer;
- an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer, wherein the upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface;
- an insulative layer coupled between the electrode and the processing layer, wherein the processing layer is made of a conductive material;
- and
- wherein the electrode further comprises a plurality of holes formed therethrough and wherein the working surface of the processing layer protrudes through the plurality of holes and extends above the upper surface of the electrode.
3 more elements
A pad assembly for processing a substrate, comprising:
- an upper layer having a working surface and a lower surface;
- an electrode coupled to the lower surface of the upper layer;
- two or more sets of parallel grooves formed in the working surface of the upper layer;
- a plurality of holes formed through the upper layer within the two or more sets of parallel grooves and extending to the lower surface;
- and wherein the plurality of holes further comprises:
- at least two concentric groupings of holes each having an open area of between about 10 to about 90 percent of the working surface, wherein at least two of the at least two groupings of holes have different size open areas.
3 more elements
A pad assembly for processing a substrate, comprising:
- an upper layer having a working surface and a lower surface;
- an electrode coupled to the lower surface of the upper layer;
- at least one groove formed in the working surface of the upper layer;
- a plurality of holes formed through the upper layer within the at least one groove and extending to the lower surface;
- and
- an insulative layer coupled between the electrode and the upper layer, wherein the upper layer is made of a conductive material.
3 more elements
A system for electro-mechanical processing a substrate, comprising:
- a platen;
- a carrier head adapted to retain the substrate during processing;
- a lower layer disposed on the platen;
- a processing layer, made of a conductive material disposed on the lower layer and having a working surface adapted to process the substrate;
- an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer, wherein the upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface;
- and
- a dielectric leyer disposed between the electrode and the processing layer.
4 more elements
Dependencies are inferred from the claim text.