Solid-state imaging apparatus and manufacturing method thereof

A method of manufacturing a solid-state imaging apparatus, comprising:

• forming a light-transmitting member by molding a material smaller in coefficient of linear expansion than an insulating resin constituting a structure member into a plate-like member;
• integrally molding the light-transmitting member and the structure member having a through-opening portion and a solid-state image pickup element attaching portion to which a solid-state image pickup element is attached to close the through-opening portion, so that the light-transmitting member is disposed to cover the through-opening portion, to be separated from said solid-state image pickup element attaching portion by a predetermined distance, and the periphery of the light-transmitting member is embedded in the structure member, by conducting a molding process by using said insulating resin as a material after placing said light-transmitting member in molding dies;
• forming a wiring portion on said structure member;
• and
• attaching said solid-state image pickup element to said solid-state image pickup element attaching portion,
• further comprising forming a penetrated hole in the structure member to face the through-opening portion.

A method of manufacturing a solid-state imaging apparatus, comprising:

• forming a light-transmitting member by molding a material smaller in coefficient of linear expansion than an insulating resin constituting a structure member into a plate-like member;
• integrally molding the light-transmitting member and the structure member having a through-opening portion and a solid-state image pickup element attaching portion to which a solid-state image pickup element is attached to close the through-opening portion, so that the light-transmitting member is disposed to cover the through-opening portion, to be separated from said solid-state image pickup element attaching portion by a predetermined distance, and the periphery of the light-transmitting member is embedded in the structure member, by conducting a molding process by using said insulating resin as a material after placing said light-transmitting member in molding dies;
• forming a wiring portion on said structure member;
• and
• attaching said solid-state image pickup element to said solid-state image pickup element attaching portion,
• further comprising forming a penetrated hole in the structure member to face the through opening,
• wherein said penetrated hole is formed at each of positions where the penetrated holes face each other across said through-opening portion in a direction perpendicular to an injection direction of the thermoplastic resin.