Optical chip module and optical chip module device

An optical chip module of an optical chip provided on an element forming face with a light emitting or light receiving element and terminals for electrical connection with said element, comprising

• an optical fiber optically bonded by coupling the optical fiber to said element with its end face abutting said element;
• the outer circumference of said optical fiber having interconnect patterns extending from the end face, and in an axial direction, of the optical fiber and electrically connected with the terminals;
• terminals of said optical chip being positioned with the interconnect patterns at the end face of said optical fiber and intersecting circumferential lines of the end face of the optical fiber abutting against said element forming face and bonded thereto;
• said terminals and interconnect patterns being electrically connected;
• and
• a conductive material coated on said terminals and the outer surface of said interconnect patterns, said terminals and interconnect patterns being electrically connected through the conductive material, and the optical chip and optical fiber being integrally bonded by the conductive material;
• and
• an adhesive coated at the outer circumference along the end face of the optical fiber abutting against said element forming face, the optical chip and optical fiber being fixed by bonding through the adhesive.

An optical chip module of an optical chip provided on an element forming face with a light emitting or light receiving element and terminals for electrical connection with said element, comprising

• an optical fiber optically bonded by coupling the optical fiber to said element with its end face abutting said element;
• the outer circumference of said optical fiber having interconnect patterns extending from the end face, and in an axial direction, of the optical fiber and electrically connected with the terminals;
• terminals of said optical chip being positioned with the interconnect patterns at the end face of said optical fiber and intersecting circumferential lines of the end face of the optical fiber abutting against said element forming face and bonded thereto;
• said terminals and interconnect patterns being electrically connected;
• and
• a dummy terminal at the element forming face of said optical chip, intersecting the outer circumferential line of the end face of the optical fiber, a conductive material or adhesive being coated between the dummy terminal and the outer surface of the optical fiber, bonding the optical chip and optical fiber.

An optical chip module of an optical chip provided on an element forming face with a light emitting or light receiving element and terminals for electrical connection with said element, comprising

• an optical fiber optically bonded by coupling the optical fiber to said element with its end face abutting said element;
• the outer circumference of said optical fiber having interconnect patterns extending from the end face, and in an axial direction, of the optical fiber and electrically connected with the terminals;
• terminals of said optical chip being positioned with the interconnect patterns at the end face of said optical fiber and intersecting circumferential lines of the end face of the optical fiber abutting against said element forming face and bonded thereto;
• and
• said terminals and interconnect patterns being electrically connected;
• and a conductive material coated at said terminals and the outer surface of said interconnect patterns, said terminals and interconnect patterns being electrically connected through the conductive material, and the optical chip and optical fiber being integrally bonded by the conductive material;
• and
• a dummy terminal at the element forming face of said optical chip, intersecting the outer circumferential line of the end face of the optical fiber, a conductive material or adhesive being coated between the dummy terminal and the outer surface of the optical fiber, bonding the optical chip and optical fiber.