US 7,028,879 B2 · System for depositing connection sites on micro C-4 semiconductor die

Abstract

A semiconductor die having multiple solder bumps, each having a diameter less than about 100 microns, and the method for making such a die are described. The pitch between the solder bumps is less than 100 microns. A thermal solder jet apparatus is utilized to deposit solder material to form the solder bumps. The apparatus includes a print head having a plurality of solder ejection ports. Each ejection port has an associated gas ejection conduit connected to a chamber containing one or more hydride films for producing hydrogen gas. The hydrogen gas is utilized to force the ejection of the solder material from the ejection port. A controller controls and choreographs the movements of the movable substrate and movable drive so as to accurately deposit material in desired locations on the semiconductor dies.

Claims29

Dependent claims

A system for depositing solder on a plurality of connection sites located on semiconductor dies, said system comprising:

a movable substrate adapted to move at least one semiconductor die in a first plane;
a movable drive including at least one print head, said movable drive adapted to move said print head in a second plane, said print head including a channel arranged and configured to utilize a gas produced from a metallic compound disposed within said print head to deposit on the semiconductor die a material ejected from a port in the print head and having a deposited diameter of less than about 100 microns;
and
a controller for controlling the movements of said movable drive and said movable substrate.

1 more element

Dependencies are inferred from the claim text.

System for depositing connection sites on micro C-4 semiconductor die

Life of this patent

System for depositing connection sites on micro C-4 semiconductor die

Life of this patent

Abstract

Claims29