Integrated circuit heat pipe heat spreader with through mounting holes

An assembly for forming a heat pipe for spreading heat comprising:

• a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber having a plurality of first particles having a first melting temperature and a brazing compound comprising a plurality of second particles having a second melting temperature that is lower than said first melting temperature whereby said plurality of first particles are joined together by said brazing compound by melting said plurality of second particles such that fillets of said brazing compound are formed between adjacent ones of said plurality of first particles so as to form a network of capillary passageways between said first particles;
• at least one depression formed in said first plate which projects into said vapor chamber and is bonded to said second plate;
• an opening defined through said first plate depression and said second plate wherein said opening is isolated from said vapor chamber;
• and
• at least one depression formed in said second plate which projects into said vapor chamber and is bonded to said first plate.