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US 7,028,759 B2Granted
Heat transfer device and method of making same
AssigneeThermal Corp.
InventorsJohn H. Rosenfeld, Donald M. Ernst
Life of this patent
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AssigneeThermal Corp.
InventorsJohn H. Rosenfeld, Donald M. Ernst
Estimating the term…
A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in the capillary structer. In this way, a network of capillary passageways are formed between the particles and vapor-vents through the capillary structure so as to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
A capillary structure for a heat transfer device comprising:
A capillary structure for a heat transfer device comprising:
A heat pipe comprising:
A heat pipe comprising:
A heat pipe comprising a sealed and partially evacuated tubular enclosure having an internal surface covered by a brazed wick comprising a plurality of copper particles joined together by a brazing compound comprising about sixty-five percent weight copper and thirty-five percent weight gold such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles and including a plurality of vapor vents defined through said wick;
A heat pipe comprising:
Dependencies are inferred from the claim text.