Twin fin arrayed cooling device with liquid chamber
AssigneeHewlett-Packard Development Company, L.P.
InventorShankar Hegde
Life of this patent
Estimating the term…
Abstract
A cooling device for dissipating heat from a component is disclosed. The cooling device includes a core with a plurality of twin fins connected with the core and a liquid chamber in thermal communication with the component. The liquid chamber includes a reservoir with a liquid therein and the core includes a cavity with a liquid therein. A heat pipe is connected with the liquid chamber and with the core and the heat pipe is in contact with the liquid in the reservoir and the liquid in the cavity so that waste heat in the liquid chamber is thermally communicated to the core and is dissipated by an air flow over the twin fins and the core.
Claims30
A cooling device for dissipating heat from a component, comprising:
- a plurality of twin fins, each twin fin including a root and a pair of vanes extending outward of the root and spaced apart to define a slot between the vanes, each vane including a leading edge, a trailing edge, and an outer edge;
- a heat pipe including a first end and a second end;
- a core including a plurality of grooves adapted to receive the root, a top face, a cavity, a liquid disposed in the cavity, and a plate connected with the core and including an aperture, the heat pipe is connected with the aperture and the first end is positioned in the cavity and is in contact with the liquid;
- and
- a liquid chamber including a reservoir, a liquid disposed in the reservoir, an aperture, and a base including a mounting surface for thermally connecting the liquid chamber with the component, the heat pipe is connected with the aperture and the second end is positioned in the reservoir and is in contact with the liquid.
A system for dissipating heat from a component, comprising:
- a cooling device including
- a plurality of twin fins, each twin fin including a root and a pair of vanes extending outward of the root and spaced apart to define a slot between the vanes, each vane including a leading edge, a trailing edge, and an outer edge;
- a heat pipe including a first end and a second end;
- a core including a plurality of grooves adapted to receive the root, a top face, a cavity, a liquid disposed in the cavity, and a plate connected with the core and including an aperture, the heat pipe is connected with the aperture, and the first end is positioned in the cavity and in contact with the liquid;
- a liquid chamber including a reservoir, a liquid disposed in the reservoir, an aperture, a base including a mounting surface for thermally connecting the liquid chamber with the component, the heat pipe is connected with the aperture, and the second end is positioned in the reservoir and in contact with the liquid;
- and
- an air flow source for generating an air flow over the vanes, the top face, the core, and through the slots to dissipate the heat from the component.
Dependencies are inferred from the claim text.