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US 7,028,754 B2Granted
High surface area heat sink
AssigneeHewlett-Packard Development Company, L.P.
InventorBrent A. Boudreaux
Life of this patent
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Abstract
A heat sink is built including a three dimensional array of cylindrical openings for air to flow through instead of fins. By having a larger surface area than heat sinks with fins, this high surface area heat sink results in increased heat transfer to the surrounding air than a similarly sized heat sink with fins. Heat sinks including an array of cylindrical openings may be manufactured through extrusion, stamping, and other common techniques.
Claims18
A beat sink comprising:
- a heat sink base;
- and
- a heat sink body mechanically and thermally coupled with said heat sink base,
- wherein said heat sink body includes a plurality of cylindrical openings;
- and
- wherein said cylindrical openings include chamfers in at least one face of said heat sink body.
3 more elements
A method for constructing a heat sink comprising the steps of:
- a) providing a heat sink base;
- b) providing a heat sink body;
- c) creating a plurality of cylindrical openings in said heat sink body, wherein said cylindrical openings include chamfers in at least one face of said heat sink body;
- and
- d) mechanically and thermally coupling said heat sink body to said heat sink base.
2 more elements
Dependencies are inferred from the claim text.