Sensor having resin mold casing and method of manufacturing the same
AssigneeDenso Corporation
InventorsMasatoshi Tokunaga, Yasuaki Makino
Life of this patent
Estimating the term…
Abstract
A sensor includes a sensing portion for sensing physical quantity, a connector portion integrated with the sensing portion for electrically connecting the sensing portion and an outer circuit outside the sensor, a sensor casing for accommodating the sensing portion, and a connector casing for accommodating the connector portion. Both the sensor casing and the connector casing are made of thermoplastic resin. The sensor casing has a predetermined portion exposed outside from the connector casing. The other portion of the sensor casing is covered with the connector casing.
Claims16
A sensor comprising:
- a sensing portion for sensing physical quantity;
- a connector portion integrated with the sensing portion for electrically connecting the sensing portion and an outer circuit outside the sensor;
- a sensor casing for accommodating the sensing portion;
- and
- a connector casing for accommodating the connector portion,
- wherein both the sensor casing and the connector casing are made of thermoplastic resin,
- wherein the sensor casing has a predetermined part exposed outside from the connector casing,
- wherein the other part of the sensor casing is covered with the connector casing,
- wherein the sensing portion is disposed on the predetermined part of the sensor casing,
- wherein the sensing portion includes a sensing element and an electric circuit for processing a signal outputted from the sensing element, and
- wherein the sensing element and the electric circuit are molded with thermoplastic resin composing the sensor casing.
A sensor comprising:
- a sensing portion for sensing physical quantity;
- a connector portion integrated with the sensing portion for electrically connecting the sensing portion and an outer circuit outside the sensor;
- a sensor casing for accommodating the sensing portion;
- and
- a connector casing for accommodating the connector portion,
- wherein both the sensor casing and the connector casing are made of thermoplastic resin,
- wherein the sensor casing has a predetermined part exposed outside from the connector casing,
- wherein the other part of the sensor casing is covered with the connector casing,
- wherein the sensing portion is disposed on the predetermined part of the sensor casing,
- wherein the sensor casing primarily molds the sensing portion, and
- wherein the connector casing secondarily molds the sensor casing except for a predetermined part of the sensor casing exposed outside of the connected casing.
A sensor comprising:
- a sensing portion for sensing physical quantity;
- a connector portion integrated with the sensing portion for electrically connecting the sensing portion and an outer circuit outside the sensor;
- a sensor casing for accommodating the sensing portion;
- and
- a connector casing for accommodating the connector portion,
- wherein both the sensor casing and the connector casing are made of thermoplastic resin,
- wherein the sensor casing has a predetermined part exposed outside from the connector casing,
- wherein the other part of the sensor casing is covered with the connector casing,
- wherein the sensing portion includes a sensing element and an electric circuit for processing a signal outputted from the sensing element, and
- wherein the sensing element and the electric circuit are molded with thermoplastic resin composing the sensor casing.
A sensor comprising:
- a sensing portion for sensing physical quantity;
- a connector portion integrated with the sensing portion for electrically connecting the sensing portion and an cuter circuit outside the sensor;
- a sensor casing for accommodating the sensing portion;
- and
- a connector casing for accommodating the connector portion,
- wherein both the sensor casing and the connector casing are made of thermoplastic resin,
- wherein the sensor casing has a predetermined part exposed outside from the connector casing,
- wherein the other part of the sensor casing is covered with the connector casing,
- wherein the sensor casing primarily molds the sensing portion, and
- wherein the connector casing secondarily molds the sensor casing except for a predetermined part of the sensor casing exposed outside from the connector casing.
A method of forming a sensor, which includes a sensing portion for sensing physical quantity, a connector portion for electrically connecting the sensing portion and an outer circuit outside the sensor, a sensor casing for accommodating the sensing portion, and a connector casing for accommodating the connector portion, the method comprising the steps of:
- molding the sensing portion with a first resin so that the sensor casing is formed;
- and
- molding the connector portion with a second resin so that the connector casing is formed,
- wherein a predetermined part of the sensor casing is exposed outside from the connector casing, and the other portion of the sensor casing is covered with the connector casing,
- wherein the sensing portion is disposed on the predetermined part of the sensor casing,
- wherein both the first and second resins are thermoplastic resin,
- wherein the first resins has physical properties such that linear coefficient of thermal expansion in a flowing direction is between 2.2 and 5.5, linear coefficient of thermal expansion in a direction perpendicular to the flowing direction is between 2.0 and 5.6, and coefficient of viscosity in case of melting state is between 46 Pa/sec. and 49 Pa/sec, and
- wherein the second resin has physical properties such that the linear coefficient of thermal expansion in the flowing direction is 1.7, the linear coefficient of thermal expansion in the direction perpendicular to the flowing direction is 6.2, and the coefficient of viscosity in case of melting state is between 100 Pa/sec. and 1000 Pa/sec.
A method of forming a sensor, which includes a sensing portion for sensing physical quantity, a connector portion for electrically connecting the sensing portion and an outer circuit outside the sensor, a sensor casing for accommodating the sensing portion and a connector casing for accommodating the connector portion, the method comprising the steps of:
- molding the sensing portion with a first resin so that the sensor casing is formed;
- and
- molding the connector portion with a second resin so that the connector casing is formed,
- wherein a predetermined part of the sensor casing is exposed outside from the connector casing, and the other portion of the sensor casing is covered with the connector casing,
- wherein physical properties of the first resin are different from those of the second resin,
- wherein the first resin provides high fluidity, and the second resin provides high mechanical strength, and
- wherein both the first and second resins are thermoplastic resin.
Dependencies are inferred from the claim text.