Method and arrangement for transporting and inspecting semiconductor substrates
AssigneeLeica Microsystems Jena GmbH
InventorsAndreas Birkner, Frank Bernhardt, Knut Hiltawski
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AssigneeLeica Microsystems Jena GmbH
InventorsAndreas Birkner, Frank Bernhardt, Knut Hiltawski
Estimating the term…
The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).
Method for transporting and inspecting semiconductor substrates, comprising the steps of:
An arrangement for transporting and inspecting semiconductor substrates, comprising:
Dependencies are inferred from the claim text.