Method of attaching a semiconductor chip to a chip mounting substrate
AssigneeRenesas Technology Corp.
InventorsShunichi Abe, Tetsuya Uebayashi, Naoki Izumi, Akira Yamazaki
Life of this patent
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Abstract
A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting substrate positioned on a first supporting device, pressing a semiconductor chip against the chip mounting substrate to bond the semiconductor chip temporarily to the chip mounting substrate temporarily bonded chip on a second supporting device, and applying chip to straighten warpage and to bond the chip entirely to the chip mounting substrate.
Claims5
A semiconductor device producing method comprising:
- a chip mounting substrate feeding process of placing a semiconductor chip mounting substrate provided with a predetermined adhesive layer on a first supporting device included in a chip mounting unit for mounting a semiconductor chip on the semiconductor chip mounting substrate;
- a chip bonding process of temporarily bonding the semiconductor chip to the semiconductor chip mounting substrate by pressing the semiconductor chip against the semiconductor chip mounting substrate;
- a transfer process of transferring the semiconductor chip mounting substrate to which the semiconductor chip is bonded temporarily by the chip bonding process from the first supporting device to a second supporting device;
- and
- a pressing process of pressing the semiconductor chip firmly against the semiconductor chip mounting substrate to bond the semiconductor chip entirely to the semiconductor chip mounting substrate.
A semiconductor device producing method comprising steps of:
- placing a semiconductor chip mounting substrate provided with a predetermined adhesive layer on a first supporting device;
- bonding a semiconductor chip to the semiconductor chip mounting substrate by pressing the semiconductor chip against the adhesive layer using a first pressing tool;
- after the bonding step, transferring the semiconductor chip mounting substrate to which the semiconductor chip is bonded by the chip bonding process from the first supporting device to a second supporting device;
- and
- after the transferring step, pressing the semiconductor chip against the adhesive layer using a second pressing tool, wherein
- pressed area on the semiconductor chip by the second pressing tool is greater than that by the first pressing tool.
Dependencies are inferred from the claim text.