Semiconductor chip pick and place process and equipment
AssigneeTexas Instruments Incorporated
InventorIszharudin Hassan
Life of this patent
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Abstract
A process and tooling for removing a semiconductor chip (31) from a handling tape (321) without damage to either the chip or tape by one or more horizontal beam type ejector tools (333) driven by a variable speed motor (332) applying uniform pressure to the tape and chip backside. Each tool (333) emerges from a rigid support surface through an aperture which also serves to supply vacuum to hold the chip in alignment prior to ejection, and in turn allows planar removal of the chip by a pick-up arm (351).
Claims13
A process for removing a selected semiconductor chip from a handling tape, comprising the steps of:
- providing an ejector assembly including one or more horizontal beam type ejectors and a rigid support surface having a plurality of apertures;
- aligning a selected chip over said one or more ejectors;
- applying vacuum through one or more of said apertures to secure the tape and chip to said support surface;
- and
- moving said one or more ejectors through said apertures against said tape and chip.
A process for removing a selected semiconductor chip from a handling tape, comprising the steps of:
- providing an ejector assembly including one or more horizontal beam type ejectors and a rigid support surface having a plurality of apertures;
- aligning a selected chip over said one or more ejectors;
- applying vacuum through one or more of said apertures to secure the tape and chip to said support surface;
- activating a motor connected to a shaft to move said one or more ejectors through said apertures against said tape and chip, and
- removing said chip by a pick-up tip.
Dependencies are inferred from the claim text.