Vibrating beam accelerometer
AssigneeHoneywell International Inc.
InventorLianzhong Yu
Life of this patent
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Abstract
Microelectromechanical system (MEMS) integrated micro devices and acceleration sensor devices formed of first and second silicon wafers that are permanently joined together in a composite silicon wafer having an array of first complete stand-alone three-dimensional micromechanical device features formed in the first silicon wafer, an array of second complete stand-alone three-dimensional micromechanical device features formed in the second silicon wafer, and one or more composite three-dimensional micromechanical device features formed of first partial three-dimensional micromechanical device features formed in the first silicon wafer that are permanently joined to cooperating second partial three-dimensional micromechanical device features formed in the second silicon wafer.
Claims20
A composite microelectromechanical system (MEMS) integrated micro acceleration sensor, comprising a substrate having formed therein a proof mass suspended from a frame by a flexure and a vibratory beam coupled between the proof mass and the frame, wherein:
- at least one of the proof mass and the frame further comprises a composite of two or more substrates, and
- at least one of the flexure and the vibratory beam is formed complete in a single one of the two or more substrates.
A composite microelectromechanical system (MEMS) integrated micro acceleration sensor, comprising:
- first and second substrates each formed of a silicon material and having top and bottom substantially parallel surfaces spaced apart by the thickness of the silicon substrate material;
- a continuous composite proof mass partially formed in each of the first and second substrates and permanently joined together;
- a continuous composite frame partially formed in each of the first and second substrates and permanently joined together;
- a flexure suspending the composite proof mass for movement relative to the composite frame;
- a vibratory beam coupled between the composite proof mass and the composite frame;
- electrical means for vibrating the vibratory beam at a resonant frequency when the composite proof mass is at rest relative to the composite frame;
- and
- electrical means for receiving a signal representative of a variation in the resonant frequency of the vibrating beam as a function of tension or compression forces being applied by movement of the composite proof mass relative to the composite frame.
A composite microelectromechanical system (MEMS) integrated micro acceleration sensor comprising:
- a proof mass suspended by a flexure from a frame, wherein:
- the proof mass further comprises a continuous composite of two partial proof masses each formed in different first and second substrates,
- the frame further comprises a continuous composite of two partial frame each formed in the different first and second substrates, and
- the flexure is formed complete in a single one of the first and second substrates;
- and
- a vibratory beam coupled between the proof mass and the frame.
A composite microelectromechanical system (MEMS) integrated sensor comprising:
- first and second silicon substrates permanently fused together in a continuous composite silicon substrate;
- one or more first complete stand-alone three-dimensional micromechanical device features formed in the first silicon substrate;
- one or more second complete stand-alone three-dimensional micromechanical device features formed in the second silicon substrate;
- and
- one or more composite three-dimensional micromechanical device features formed of first partial three-dimensional micromechanical device features formed in the first silicon substrate that are permanently joined to cooperating second partial three-dimensional micromechanical device features formed in the second silicon substrate.
Dependencies are inferred from the claim text.