Full swath analysis

An inspection system for detecting anomalies on a substrate, the inspection system comprising:

• a sensor array adapted to generate image data and provide the image data in four sections,
• a first high speed network having four independent lines, each of the four independent lines coupled to a corresponding one of the four sections of the sensor array, and adapted to receive and communicate the image data, wherein the first high speed network is a fiber optic network that implements a serial, full duplex data transfer architecture, the first high speed network,
• an array of process nodes coupled to the first high speed network and adapted to receive and process the image data to produce anomaly reports, the array of process nodes having four columns of process nodes, where each of the four columns of process nodes is coupled to a corresponding one of the four independent lines, each process node having,
• an interface card coupled to the first high speed network and adapted to receive the image data from the first high speed network and format the image data according to a high speed interface bus protocol, wherein the high speed interface bus protocol is PCI-X, each interface card having,
• a field programmable gate array adapted to format the image data for transfer according to the high speed interface bus protocol,
• a memory adapted to receive and buffer the image data between the interface card and the computer,
• four fiber inputs adapted to receive the image data from the first high speed network,
• a high speed interface bus coupled to the interface card and adapted to receive the image data from the interface card, and
• a computer coupled to the high speed interface bus and adapted to receive the image data from the high speed interface bus and process the image data according to an algorithm to produce the anomaly report,
• wherein each of the process nodes has an amount of memory that is sufficient to receive image data representing a plurality of dice on an integrated circuit wafer, and each of the process nodes performs analysis on the plurality of dice,
• a second high speed network coupled to the process nodes and adapted to receive the anomaly reports from the process nodes, wherein the second high speed network is a gigabit Ethernet network, and
• a job manager coupled to the second high speed network and adapted to receive the anomaly reports from the process nodes and send information to the process nodes to coordinate the processing of the image data in the array of process nodes.