Ceramic optical sub-assembly for optoelectronic modules

An optoelectronic package enabling optical communication with an optical fiber, the package comprising:

• a ceramic backing block having a front face and a bottom face that are angled at a 90 degree angle relative to one another defining a right angle corner, the block being suitable for supporting photonic device on the front face of the backing block and being suitable for aligning the photonic device with an external optical fiber when the optical fiber is mechanically engaged with the package at the front face of the block;
• an electrical circuitry set that is deposited directly onto the front and bottom face of the ceramic backing block, the circuitry set including a metal pad formed on the front face and metal traces that extend from the front face to the bottom face extending around the right angle corner;
• a semiconductor chip assembly mounted to the bottom thee of the backing block, the semiconductor chip assembly having a first surface having a plurality of first contacts that are electrically coupled to associated traces on the bottom face of the backing block by direct soldering and a second surface opposite the first surface, the second surface of the semiconductor chip assembly having plurality of second contacts that are suitable for electrical connection to external devices;
• and
• the photonic device having at least a first surface and a second surface wherein the first surface and the second surface are on opposing sides of the photonic device an active facet, a cathode, and at least one anode thereon, wherein the cathode is on the first surface and the active facet and the anode are on the second surface, the first surface of the photonic device being mounted directly onto the front side of the of the ceramic backing block and electrically connected such that the cathode is in contact with the metal pad.