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US 7,023,702 B2Granted
Apparatus including circuit board and heat sink and method of making the apparatus
AssigneeIntel Corporation
InventorMike G. MacGregor
Life of this patent
Estimating the term…
Abstract
In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one lower member soldered to the circuit board, and an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener.
Claims23
An apparatus comprising:
- a circuit board;
- a plurality of metal inserts;
- and
- a heat sink having a plurality of mounting holes;
- each of the metal inserts including:
- at least one lower member soldered to the circuit board;
- and
- an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener;
- wherein each of the fasteners is received within the upper portion of a respective one of the metal inserts;
- and
- wherein the upper portion of each of the metal inserts is swage-formed by the respective fastener to the respective one of the mounting holes of the heat sink.
8 more elements
An apparatus comprising:
- a circuit board;
- a plurality of metal inserts;
- and
- a heat sink having a plurality of mounting holes;
- each of the metal inserts including:
- at least one lower member soldered to the circuit board;
- and
- an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener;
- wherein the upper portion of each of the metal inserts includes a pair of barrel segments which together define a substantially cylindrical space in which the respective fastener is received.
6 more elements
An article of manufacture comprising:
- a substantially rectangular plastic frame having four corners;
- four metal inserts each mounted at a respective one of the four corners of the frame, each of the metal inserts including:
- at least one pin-shaped lower member to be soldered to a circuit board;
- and
- an upper portion to be secured to a heat sink.
2 more elements
A method comprising:
- soldering a plurality of metal inserts to a circuit board;
- installing a heat sink on the soldered metal inserts such that a respective upper portion of each of the metal inserts is inserted into a respective mounting hole of the heat sink;
- and
- driving a respective screw into the respective upper portion of each of the metal inserts to secure the heat sink to the metal inserts.
1 more element
A system comprising:
- a circuit board;
- a processor mounted on the circuit board;
- a plurality of metal inserts;
- and
- a heat sink that is thermally coupled to the processor, the heat sink having a plurality of mounting holes;
- each of the metal inserts including:
- at least one lower member soldered to the circuit board;
- and
- an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener;
- wherein the plurality of metal inserts includes four metal inserts.
7 more elements
Dependencies are inferred from the claim text.