Laminated ceramic capacitor, mounted structure of laminated ceramic capacitor, and capacitor module
AssigneeTaiyo Yuden Co., Ltd.
InventorSatoshi Kazama
Life of this patent
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Abstract
In this laminated ceramic capacitor, a heat radiation conductor is provided on a top face of a rectangular parallelepiped laminated chip where a plurality of first conductor layers and a plurality of second conductor layers are arranged alternatively through each ceramic layer with facing each other. In addition, the heat radiation conductor is connected to the upper edge of each second conductor layer. Therefore, when heat is generated in each first conductor layer and each second conductor layer which play the role of internal electrodes, the heat of each second conductor layer is directly transferred from each second conductor layer to the heat radiation conductor, and is radiated outside from the heat radiation conductor.
Claims27
A laminated ceramic capacitor comprising:
- a rectangular parallelepiped laminated chip having a plurality of first conductor layers and a plurality of second conductor layers, the first conductor layers and the second conductor layers being alternately arranged to face each other through a ceramic layer;
- at least one first electrode which is provided on one face of the laminated chip and conducts with the first conductor layers;
- at least one second electrode which is provided in the one face of the laminated chip without contacting with the first electrode, and conducts with the second conductor layers;
- and
- at least one heat radiation conductor which is provided on at least one face different from the one face of the laminated chip, and conducts with at least one of the first conductor layers and the second conductor layers.
A mounted structure comprising:
- at least one laminated ceramic capacitor mounted on a substrate so that a first electrode of the laminated ceramic capacitor is connected to a first land on a mounting surface of the substrate and a second electrode of the laminated ceramic capacitor is connected to a second land on the mounting surface of the substrate,
- wherein the laminated capacitor includes,
- a rectangular parallelepiped laminated chip having a plurality of first conductor layers and a plurality of second conductor layers, the first conductor layers and the second conductor layers being alternately arranged to face each other through a ceramic layer;
- at least one first electrode which is provided on one face of the laminated chip and conducts with the first conductor layers;
- at least one second electrode which is provided in the one face of the laminated chip without contacting with the first electrode, and conducts with the second conductor layers;
- and
- at least one heat radiation conductor which is provided on at least one face different from the one face of the laminated chip, and conducts with at least one of the first conductor layers and the second conductor layers.
A capacitor module comprising:
- a conductive plate with a predetermined shape;
- and
- a plurality of laminated ceramic capacitors including, a rectangular parallelepiped laminated chip having a plurality of first conductor layers and a plurality of second conductor layers, the first conductor layers and the second conductor layers being alternately arranged to face each other through a ceramic layer;
- at least one first electrode which is provided on one face of the laminated chip and conducts with the first conductor layers;
- at least one second electrode which is provided in the one face of the laminated chip without contacting with the first electrode, and conducts with the second conductor layers;
- and at least one heat radiation conductor which is provided on at least one face different from the one face of the laminated chip, and conducts with at least one of the first conductor layers and the second conductor layers,
- wherein the capacitor module is constituted by providing each laminated ceramic capacitor on the conductive plate in predetermined arrangement so that a face different from the one face of each laminated chip faces the conductive plate, and at least one of the first conductor layers and second conductor layers conduct with the conductive plate.
Dependencies are inferred from the claim text.