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US 7,023,315 B2Granted
High performance RF inductors and transformers using bonding technique
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorsKiat Seng Yeo, Hai Peng Tan, Jianguo Ma, Manh Anh Do, Kok Wai Johnny Chew
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Abstract
A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.
Claims8
A wire bond inductor comprising:
- semiconductor device structures in and on a semiconductor substrate;
- bonding pads overlying said semiconductor device structures;
- wedge bond wires underlying and connecting said bonding pads;
- input/output connections to two of said bonding pads;
- and
- a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor.
3 more elements
A wire bond inductor comprising:
- semiconductor device structures in and on a semiconductor substrate;
- bonding pads overlying said semiconductor device structures;
- wedge bond wire underlying and connecting said bonding pads;
- input/output connections to two of said bonding pads;
- and
- a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor and wherein said inductor has a meander, spiral, or solenoid shape.
3 more elements
A transformer comprising:
- bonding pads over a semiconductor substrate;
- wedge bond wire underlying and connecting said bonding pads;
- first input/output connections to two of said bonding pads;
- second input/output connections to another two of said bonding pads;
- and
- a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops connecting to said first input/output connections form a first inductor and wherein said bond wire loops connecting to said second input/output connections form a second inductor and wherein said first and second inductors together form said transformer.
3 more elements
Dependencies are inferred from the claim text.