Apparatus for socketing and testing integrated circuits and methods of operating the same
AssigneeNational Semiconductor Corporation
InventorKern W. Wong
Life of this patent
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Abstract
There is disclosed apparatus for socketing and testing integrated circuits, particularly RF and high-frequency integrated circuits in high density and fine pitch packages, and methods of operating the same. An exemplary apparatus includes an air machine and a housing. The housing includes a universal printed circuit board that is operable to receive a device under test, a controller that is operable to control testing of the received device under test, and a power supply. The housing and the air machine are associable to form an at least substantially air-tight chamber ensconcing the received device under test.
Claims20
An apparatus for socketing and testing integrated circuits comprising:
- an air machine that is operable to controllably provide a thermally-varying air flow;
- and
- a housing comprising (i) a printed circuit board that is operable to receive a device under test, the printed circuit board comprising a leadless socket operable to receive the device under test, and (ii) a controller that is operable to control testing of the received device under test;
- wherein said air machine is associable with said housing to form an at least substantially air-tight chamber ensconcing the received device under test.
A method of operating an apparatus for socketing and testing integrated circuits, said apparatus comprising an air machine and a housing, said housing comprising a printed circuit board and a controller, said method comprising the steps of:
- (i) receiving a device under test at the printed circuit board, the printed circuit board comprising a leadless socket operable to receive the device under test, and
- (ii) associating said air machine with said housing to form an at least substantially air-tight chamber ensconcing the received device under test, the air machine operable to controllably provide a thermally-varying air flow.
An apparatus for socketing and testing integrated circuits comprising:
- an air machine that is operable to controllably provide a thermally-varying air flow;
- and
- a housing comprising (i) a universal printed circuit board that is operable to receive a device under test, the printed circuit board comprising a leadless socket operable to receive the device under test, (ii) a controller that is operable to control testing of the received device under test, and (iii) a power supply;
- wherein said air machine is associable with said housing to form an at least substantially air-tight chamber ensconcing the received device under test.
Dependencies are inferred from the claim text.