Probe pins zero-point detecting method, and prober
AssigneesOctec Inc., Tokyo Electron Limited
InventorsKatsuya Okumura, Kunihiro Furuya
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Abstract
A zero-point detecting method of this invention is performed prior to testing the electrical characteristics of a wafer by bringing an object to be tested on a stage and probes of a probe card into contact with each other. The surface of a zero-point detection plate is made of a conductive material (e.g., copper). The zero-point detection plate is used to detect a zero point as a position where the surface of the object to be tested comes into contact with the probe pins.
Claims7
A prober for testing electrical characteristics of an object to be tested while electrodes of the object to be tested and probe pins are in contact with each other, the prober comprising:
- a stage which places an object to be tested thereon;
- a probe card having a plurality of probe pins and arranged to oppose the stage;
- a zero-point detection plate, a surface of the zero-point detection plate being made of a conductive material, the zero-point detection plate being used to detect a zero point as a position where an electrode surfaces of the object to be tested comes into contact with the probe pins;
- a heating mechanism which heats the zero-point detection plate;
- and
- a reducing gas supply mechanism configured to bring a reducing gas into contact with the zero-point detection plate.
Dependencies are inferred from the claim text.