Resin composition for encapsulating semiconductor chip and semiconductor device therewith
AssigneeSumitomo Bakelite Co., Ltd.
InventorsKuniharu Umeno, Shigehisa Ueda
Life of this patent
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Abstract
An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition for encapsulating a semiconductor chip containing an epoxy resin (A), a phenol resin (B), an inorganic filler (C) and a curing accelerator (D) as main components, and further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and Compound (F) contains two hydroxyl groups combined with each of adjacent carbon atoms in an aromatic ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.
Claims14
A resin composition for encapsulating a semiconductor chip comprising:
- an epoxy resin (A);
- a phenol resin (B);
- an inorganic filler (C);
- a curing accelerator (D);
- a silane coupling agent (E);
- and
- Compound (F) containing two or more hydroxyl groups combined with each of adjacent carbon atoms comprising an aromatic rings,
- wherein the epoxy resin (A) is a member selected from the group consisting of phenol novolac type epoxy resins, cresol novolac type epoxy resins, biphenyl type epoxy resins, bisphenol type epoxy resins, stilbene type epoxy resins, triphenolmethane type epoxy resins, phenolaralkyl (including a phenylene or biphenylene structure) type epoxy resins, naphthol type epoxy resins, alkyl-modified triphenolmethane type epoxy resins, triazine-structure containing type epoxy resins, dicyclopentadiene-modified phenol type epoxy resins, and mixtures thereof.
A resin composition for encapsulating a semiconductor chip comprising:
- an epoxy resin (A);
- a phenol resin (B);
- an inorganic filler (C);
- a curing accelerator (D);
- a silane coupling agent (E);
- and
- Compound (F) containing two or more hydroxyl groups combined with each of adjacent carbon atoms comprising an aromatic ring;
- wherein said epoxy resin (A) comprises an epoxy resin represented by general formula (1):
- wherein R1 represents a single bond or saturated or unsaturated hydrocarbon having up to three carbon atoms;
- R2 to R9, which may be the same or different from each other, represent hydrogen or saturated hydrocarbon having up to four carbon atoms;
- and n is a positive number more than 0 and up to 5 as an average, in 50 wt % or more.
Dependencies are inferred from the claim text.