Carrier
AssigneeAu Optronics Corporation
InventorsChun-Yu Lee, Hui-Chang Chen
Life of this patent
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Abstract
A carrier is provided. The carrier is bonded with a substrate having a number of contact pads through an anisotropic conductive film by thermocompression. The carrier includes a base and a number of leads, wherein the base has a base's surface on which a number of indented patterns are disposed. The leads are disposed on the base's surface with their one end, which are electrically connected to the contact pads through the anisotropic conductive film, being alternately arranged with the indented patterns; meanwhile, part of the anisotropic conductive film spread into the indented patterns when the carrier is bonded to the substrate by thermocompression.
Claims16
A carrier, which is bonded with a substrate with a plurality of contact pads through an anisotropic conductive film (ACF) by thermocompression, comprising:
- a base, which has a base's surface on which a plurality of indented patterns are disposed;
- and
- a plurality of leads disposed on the base's surface with their one end, which are electrically connected to the contact pads through the anisotropic conductive film, being alternately arranged with the indented patterns, wherein part of the anisotropic conductive film spread into the indented patterns when the carrier is bonded with the substrate by thermocompression.
A semiconductor structure, comprising:
- a substrate, which has a substrate's surface on which a plurality of contact pads are disposed;
- a carrier comprising:
- a base which has a base's surface on which a plurality of indented patterns are disposed;
- and
- a plurality of leads which are disposed on the base's surface with their one end being alternately arranged with the indented patterns;
- and
- an anisotropic conductive film, which adheres part of the substrate's surface and part of the base's surface, for electrically connecting one end of these leads with these contact pads, wherein part of the anisotropic conductive film spreads into the indented patterns when the carrier is hot sealed with the substrate.
Dependencies are inferred from the claim text.