US 7,023,086 B2 · Semiconductor component arrangement with a reduced oscillation tendency

Abstract

The present invention relates to a circuit assembly with at least two semiconductor components, each having terminals, whereby at least one terminal of the first semiconductor component is connected to a terminal of the other semiconductor component in an electrically conductive manner. The circuit assembly damps high-frequency oscillations that occur during switching operations. An eddy-current damping structure is provided above said assembly at a distance from the semiconductor components or said semiconductor components are directly connected to each other by means of a high-resistance wire connection in addition to the existent electroconductive connection.

Claims17

Dependent claims

A circuit arrangement having at least two semiconductor components each having terminals, said semiconductor components being applied to a carrier arrangement, at least one terminal of one semiconductor component being electrically conductively connected to a terminal of the other semiconductor component, the circuit arrangement comprising:

an eddy current attenuation structure provided above or below the carrier arrangement;
wherein the structure is spaced apart from the semiconductor components;
and
wherein the structure is designed to attenuated high-frequency electromagnetic oscillations that emerge from the semiconductor components or leads.

1 more element

Dependencies are inferred from the claim text.

Semiconductor component arrangement with a reduced oscillation tendency

Life of this patent

Semiconductor component arrangement with a reduced oscillation tendency

Life of this patent

Abstract

Claims17