Plastic packaging with high heat dissipation and method for the same

A high heat dissipation plastic package comprising:

• a Cu foil resin film, containing an adhesive resin and a Cu foil, is bonded to a heat dissipation plate, and includes a cut-out for a cavity at an essentially central position, when seen from above, in which is mounted a semiconductor element;
• the heat dissipation plate that dissipates heat generated by said semiconductor element, and comprises:
• respective Cu foil resin films bonded to top and bottom surfaces of the heat dissipation plate;
• and
• a hole for a through-hole that provides electrical continuity between the top surface and the bottom surface of the heat dissipation plate;
• wherein said through-hole is lined along an outer circumference with adhesive resin that insulates the heat dissipation plate from a Cu plating disposed along an inner diameter of the through-hole;
• conductor wiring patterns are formed on said Cu foil resin film;
• and
• an insulative resin is disposed on said bottom surface of said heat dissipation plate.