Land pattern configuration
AssigneeSharp Kabushiki Kaisha
InventorTetsuhide Okahashi
Life of this patent
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Abstract
The pin pitches on the respective edges of a plurality of selectively mounted semiconductor devices match one another, and the distances between the edges differ from one another. Shared lands are arranged so as to correspond to contact pins disposed on one edge of the respective semiconductor devices. Accordingly, selectively mounting a plurality of types of semiconductor devices onto a printed circuit board is achieved while saving space.
Claims5
A land pattern configuration disposed on a printed circuit board for enabling a plurality of types of semiconductor devices comprising contact pins to be selectively mounted onto the printed circuit board, the land pattern configuration comprising:
- a plurality of lands,
- wherein at least one of the plurality of lands is arranged as a shared land corresponding to contact pins of the plurality of types of semiconductor devices, and at least one contact pin of these semiconductor devices is connected to the shared land when any of these semiconductor devices is mounted.
Dependencies are inferred from the claim text.